Samsung celebrates the first shipment of 3nm Gate-All-Around chips

Samsung began the manufacture of chips using the 3nm Gate-All-Around (GAA) process last month and today it held a ceremony to celebrate the first shipment of such chips.

The ceremony was attended by around 100 people, including company executives and employees, CEOs of companies looking to use the new tech as well as Lee Chang-yang, the Minister of Trade, Industry and Energy, who pledged support for the country’s semiconductor ecosystem.

Left to right: Samsung Electronics CEO, Minister Lee Chang-yang and CEO of Samsung’s Foundry Division

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